UHP Slit Valve Doors increase wafer yield

Parker’s Composite Sealing Systems Division has introduced the UHP Slit Valve Door, an engineered sealing system designed to improve productivity and reduce downtime in critical semiconductor processing applications. Developed in co-operation with a leading semiconductor OEM, the UHP Slit Valve Door consists of a sealing element chemically bonded to an aluminium or stainless steel door. This sealing element typically consists of Parker’s chemical-resistant, thermally stable Parofluor (perfluorinated FFKM) or fluorocarbon (FKM) compounds. The bonded seal and UHP processing are designed to eliminate leaks and contamination.

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