Increased emphasis on traceability in the semiconductor industries, pharmacy and biotechnology has led Polysoude to develop a device enabling to save and store all the welding parameters for any weld performed.
Orbimatic GmbH has introduced the Orbiweld 12 and VK19 Water Cooled Micro Weld Head, for welding the small-bore tube and micro weld fittings used in the fabrication of high-purity stainless steel pipelines for the semiconductor and electronics industry.
New ultra-miniature ball screws are available in diameters as small as 3mm with choice of 1 or 0.5mm pitch.
Cabot Supermetals will build a facility for manufacturing tantalum sputtering targets and high performance materials for use in semiconductor, optics, magnetics and flat panel display thin film applications.
The Arc Machines, Inc. Model 207 is a 100/150 amp pre-programmed / programmable power supply and controller capable of welding tubing and thin wall pipe.
Parker Filter Division Europe has extended its Advantage PFA fluoropolymer single cartridge filter vessels series with the introduction of a new 20in version.
Toshiba Corporation today has announced moves to reinforce its ability to meet growing demand in the Chinese semiconductor market that include taking full control of a manufacturing joint venture and a move to new manufacturing facilities.
Ultra-Flex Garlock Sealing Technologies has introduced a new metallic seal designed to meet the demanding requirements of the semiconductor, ultra-high vacuum, space and nuclear industries.
A new alloy known as Carpenter Chrome Core® 29 Solenoid Quality stainless may be considered for use in corrosive, high purity environments such as those encountered in the semiconductor manufacturing industry and other corrosive aqueous environments.
Philips group of companies in Malaysia will invest some USD 200 million in the next four years to expand its semiconductor plant in Seremban, Southern Malaysia.